http://www.renesas.com/media/products/common_info/package/pdf/jeitacode_e.pdf http://www.intel.com/design/packtech/packbook.htm http://images.google.com/images?q=PACKAGE+OUTLINE+DRAWING+site%3Asemiconductors.philips.com+GIF&btnG=Search&svnum=10&hl=en&lr=&safe=off Very detailed specifications for many device packages

• http://www.xilinx.com/bvdocs/userguides/ug112.pdf

nice pictures with names

• http://images.google.com/images?q=www.national.com/images/pkg/&svnum=10&hl=en&lr=&safe=off&start=0&sa=N&filter=0
• http://www.national.com/packaging/parts/#HERMETIC
• http://www.xs4all.nl/~ganswijk/chipdir/package.htm

Contents 1 Common 2 Thru-Hole 3 Surface Mount 4 Leadless 5 ALL

CommonEdit

Thru-HoleEdit

Surface MountEdit

LeadlessEdit

ALLEdit

Image	Abbrv	Full Name
	BQFP	Bumpered Quad Flat Package
	BQFPH	Bumpered Quad Flat Package with Heat spreader
	CBGA	Ceramic Ball Grid Array.
	CCC	Ceramic (leadless) Chip Carrier
	CDIP	Ceramic Dual In-line Package.
	CERQUAD	CERamic QUAD in-line package
	CLCC	Ceramic Leadless Chip Carrier.
	CMPAK	Compact Mini PAcKage Hitachi diode
	CMPAK	Compact Mini PAcKage Hitachi transistor
	CPGA	Ceramic Pin Grid Array.
	CSP	Laminated Chip Scale Package.
	CerDIP	CERamic Dual In-line Package.
	CerPack	CERamic flatPACK
	DFP	Dual Flat Package
	DIL	Dual In-Line (8,14,16,18,20,22,24,28,32,40,48)
	DIMM	Dual In-line Memory Module
	DIP	Dual In-line Package.
	DPAK	Deca-Watt Package Hitachi transistor
	DSO	Dual Small Outline package
	EBGA	Enhanced Ball Grid Array
	EQUAD
	FC	Flip Chip
	FC-PGA	Flip Chip Pin Grid Array Intel term
	FPAK	Flat PAcKage Hitachi diode
	FBGA,FPBGA	Fine Pitch Ball Grid Array.
	FPQFP	Fine Pitch Quad Flat Package
	FPT	Fine Pitch Technology
	FQFP	Fine Pitch Quad Flat Package
	HDPAK	Huge Deca-watt PAcKage Hitachi transistor
	HQFI	Heat sinked QFI
	HQFP	Heat sinked QFP
	HQSOP	Hermetic QSOP (20,24)
	HSOI	Heat sinked SOI
	HSOJ	Heat sinked SOJ
	HSOP	Heat sinked SOP
	LCBGA	Low Cost Ball Grid Array.
	LCC	Leadless Chip Carrier or Leadless Ceramic Carrier
	LCCC	Leadless Ceramic Chip Carrier
	LDPAK	Large Deca-watt PAcKage Hitachi diode
	LFBGA	Unknown
	LGA	Land Grid Array
	LLD	LeadLess Diode Hitachi diode
	LQFP	Low profile QFP
	LRP	Large Resin Package Hitachi diode
	L-SIM	Single In-line Memory (Module)
	L-DIM	Dual In-line Memory (Module)
	Micro-PGA	Micro Pin Grid Array Intel term
	Micro-Array	Micro array
	Micro-SMD	Micro surface mount device
	MOP	Mini Oct-Lead Package Hitachi transistor
	MPAK	Mini PAcKage Hitachi transistor
	MQFP	Metric Quad Flat Package
	MQFP2	Metric Quad Flat Package with heat sink
	MQFPH	Metric Quad Flat Package with Heat spreader
	MQUAD	Metric QUAD flat package
	OLGA	Organic Land Grid Array (Intel term) which uses Controlled Collapse Chip Connection (C4)
	PBGA	Plastic Ball Grid Array.
	PDIL	Plastic Dual In-Line package
	PDIP	Plastic Dual In-Line Package.
	PGA	Pin Grid Array.
	PLCC	Plastic Leaded Chip Carrier (20,28,32,44,52,68,84).
	PLCCH	Plastic Leaded Chip Carrier with Heat spreader
	PLGA	Plastic Land Grid Array Intel term
	PPGA	Plastic Pin Grid Array.
	PQ2	Power Quad flat package type 2
	PQFJ	SAME AS PLCC
	PQFP	Plastic Quad Flat Package
	PSOP	Plastic Small Outline package
	PSOP-2	Plastic Small Outline package
	QFI	Quad Flat I-leaded package
	QFJ	Quad Flat J-leaded package
	QFN	Quad Flat Non-leaded package
	QFP	Quad Flat Package (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160)
	QIL	Quad In-Line package
	QIP	Quad In-line Package
	QSOP	Quarter Size Outline Package (16,20,24,28) or Quality Small Outline Package
	QTCP	Quad Tape Carrier Package
	QUAD	QUAD in-line package
	QUIL	QUad In-Line package
	QUIP	QUad In-line Package
	SD	Side-brazed ceramic Dual in-line package
	SDIP	Shrink Dual In-line Package
	SECC	Single Edge Cartridge Connector Intel term
	SGA	Solder Grid Array
	SHRDIL	SHRink Dual In-Line (20,24,32,42,52,64)
	SIL	Single In-Line (9,13,17)
	SIMM	Single In-line Memory Module
	SIP	Single In-line Package
	SIP	Single In-line Package
	SMPAK	Super Mini Package Hitachi transistor
	SO-79
	SO	See SOIC
	SOD	Small Outline Diode
	SOG	Small Outline IC with Gull-wing leads
	SOI	Small Outline I-leaded package
	SOIC	Small Outline Integrated Circuit (same as SO)
	SOJ	Small Outline J-leaded package
	SONB	Small Outline Narrow-Body IC with gull-wing leads
	SONQFN	Small Outline Non-Leaded Package
	SOP	Small Outline Package.
	SOT	Small Outline Transistor.
	SOT-23	Small Outline Transistor.
	SP-10	Single in line Package 10 pin Hitachi transistor
	SP-12	Single in line Package 12 pin Hitachi diode
	SPAK	Small PAcKage Hitachi transistor
	SQFP	Shrink Quad Flat Pack (32,48,64,80,208,240)
	SQFP2	Shrink Quad Flat Package with heat sink
	SQFPH	Shrink Quad Flat Package with Heat spreader
	SRP	Small Resin Package Hitachi diode
	SSO	Single Small Outline package/
	SSOP	Small Shrink Outline Package (20,24,28,48,56).
	SSP	Super Small resin Package Hitachi diode
	TAB	Tape Automated Bonding
	TCCN	Unknown
	TCSP	LAMINATED T chip scale package
	TD	Top-brazed ceramic Dual in-line package
100px	TEPBGA	Unknown
	TFBGA	Unknown
	TO	Transistor single Outline package or Through-Hole Transistor
	TO92	Unknown
	TO218	Unknown
	TO220	Unknown
	TO247	Unknown
	TO251	Unknown
	TO252	Unknown
	TO262	Unknown
	TO263	Unknown
	TO92	Unknown
	TQFP	Thin Quad Flat Package
	TQFP2	Thin Quad Flat Package with heat sink
	TQFPT	Thin Quad Flat Package with 1.0 mm body Thickness
	TSOP	Thin Small Outline Package
	TSOPII	Thin Small Outline Package type II
	TSQFP	Thin Shrink Quad Flat Pack (44,64,100)
	TSSOP	Thin Shrink Small Outline Package (20,24,28,48,56).
	UCSP	LAMINATED U chip scale package
	FBGA,FPBGA	Fine Pitch Ball Grid Array.
	UMD	Ultra Mini Diode Hitachi transistor
	UPAK	Uni-Watt Package Hitachi diode
	URP	Ultra small Resin Package Hitachi transistor
	VQFN	Unknown
	VQFP	Very small Quad Flat Package
	VSO	Very Small Outline (40,56)
	VSOP	Very Small Outline Package
	VTQFP	Very Thin Quad Flat Package
	VTSOP	Very Thin Small Outline Package.
	ZIP	Zigzag In-line Package
	µBGA	Micro Ball Grid Array.