How to identify chip packages/Non-standard

CO chip-on, Non-packaged devices

• COB - chip-on-board
• COF - chip-on-flex
• COG - chip-on-glass

PoP: Package-on-Package

Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP)

• PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor)

[1]

• MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor)

[2]

• S-CSP: Stacked CSP