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How to identify chip packages/Non-standard

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CO chip-on, Non-packaged devicesEdit

  • COB - chip-on-board
  • COF - chip-on-flex
  • COG - chip-on-glass


PoP: Package-on-PackageEdit

Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP)

  • PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor)

[1]

  • MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor)

[2]

  • S-CSP: Stacked CSP

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