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CO chip-on, Non-packaged devicesEdit
- COB - chip-on-board
- COF - chip-on-flex
- COG - chip-on-glass
Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP)
- PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor)
- MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor)
- S-CSP: Stacked CSP