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How to identify chip packages/Ball grid array

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  • SGA: Solder Grid Array


BGA: Ball grid arrayEdit

  • BGA: Ball grid array



Image Abbrv Full Name JEDEC/JEITA
Blank add chip BGA1 BGA (Intel Pentium II)
Blank add chip BGA2: BGA (Intel Pentium III)
Blank add chip CBGA Ceramic BGA [1]
Blank add chip CVBGA Very Thin Chip Array BGA (Amkor)

[2]

Blank add chip CSBGA  ? [3]
Blank add chip CSPBGA Chip Scale Package BGA

[4]

Blank add chip CABGA Chip array BGA (Amkor)

[5]

Blank add chip CTBGA ChipArray Thin Core BGA (Amkor)

JEDEC MS-034 [6]

Blank add chip CMBGA, CmBGA Ceramic mini BGA
Blank add chip CDTBGA Cavity Down Tape BGA [7]


Blank add chip DBGA Dimpled BGA [8]
Blank add chip DSBGA Die size BGA [9]
Blank add chip D2BGA Die Dimension BGA (NEC) [10]
Blank add chip ezBGA  ?


EBGA 515L EBGA (thermally) Enhanced BGA [11]
Blank add chip EDHSBGA Exposed Drop-In Heat Sink BGA [12]
FBGA 192L FBGA, FPBGA Fine pitch BGA JEDEC MO-205

[13]

Blank add chip fcLBGA Flip chip low profile BGA
Blank add chip SG-FCLBGA Silicon green flip chip low profile BGA [14]
FCBGA 256L FCBGA, FC-BGA Flip Chip BGA
256 lead HP-fcBGA, High performance flip Chip BGA [15]
256 lead XP-fcBGA Extra performance flip Chip BGA [16]
HBGA 456L HBGA Heat Spreader BGA
Blank add chip HBGA High power BGA

[17]

Blank add chip HBGA Hybrid fine line flip chip BGA

[18]

Blank add chip HSBGA Heat Slug/spreader/sink BGA
Blank add chip HPBGA High Performance BGA

[19]


Blank add chip LFBGA Low profile fine pitch BGA

JEDEC Standard No. 75, JESD75 [20] [21]

Blank add chip LCBGA Low Cost BGA
Blank add chip L2BGA Laser Laminated BGA
Blank add chip LBGA Laminate BGA
Blank add chip LBGA Low-Profile BGA [22]
Blank add chip LTBGA Low-Profile Tape BGA
Blank add chip MBGA Metal substraight BGA
Blank add chip M2BGA Mitsui mini BGA
Blank add chip MCBGA Multi-Chip BGA [23]
Blank add chip MCM-PBGA, MCM-BGA Multi-Chip Module Plastic BGA JEDEC MS-034

[24]

Blank add chip MCM-CBGA, MCM-BGA Multi-Chip Module Ceramic BGA JEDEC MS-034

[25]

Blank add chip MOSFET BGA MOSFET BGA [26]
PBGA 156L PBGA Plastic BGA

[27]

Blank add chip PFBGA Plastic Fine Pitch BGA [28]
Blank add chip SBGA Spreader BGA, heatsink [29]
Blank add chip STFBGA Stacked Thin profile Fine pitch BGA [30]
Blank add chip SBGA SuperBGA (Amkor)

JEDEC MO-192 [31]

Blank add chip TBGA Tape BGA [32]
TFBGA 128L TFBGA Thin-profile Fine-pitch BGA [33]
TEPBGA 324L TEPBGA Thermally Enhanced Plastic BGA [34]
Blank add chip TFTBGA Thin profile Fine pitch Tape BGA [35]
Blank add chip TABGA TapeArray BGA (.5, .8, 1.0mm Pitch) (Amkor)

JEDEC Compliant MO-195—0.5mm, MO-216—0.8mm, MO-192—1.0mm [36]

UFBGA 100L UFBGA Laminated Plastic BGA?

[37]

Blank add chip ViperBGA (ProLinx) [38]
Blank add chip VBGA Very Thin Profile Ball-Grid-Array
Blank add chip VFBGA very thin profile, fine pitch BGA

JEDEC JC-11 registration - MO-225 [39] [40]

Blank add chip μBGA, uBGA, MBGA micro BGA
Blank add chip UBGA Ultra thin BGA
Blank add chip μFCBGA, uFCBGA micro Flip Chip BGA Pentium 4
Blank add chip  ?????? Bumped Die, Flip Chip on Substrate

[41]

MICRO SMDEdit

Image Abbrv Full Name JEDEC/JEITA
20L MICRO SMD Micro-SMD  ?

[42]

MICRO SMD-A 14L Micro-SMD-A  ?
Blank add chip Thin MICRO SMD  ?

[43]

Blank add chip MICRO SMDxt  ?

[44]

MICRO ARRAY 81L MICRO-ARRAY  ?

[45]



CSP: chip scale packageEdit

LAMINATED CSP 16L

16 lead CSP, bottom view

CSP: Laminated Wafer level CSP, WL: Wafer level [46]

Image Abbrv Full Name JEDEC/JEITA
Blank add chip 3DS-WLCSP 3d Stacking Wafer-Level CSP
Blank add chip CSP^nl True Wafer level CSP

[47]

Blank add chip CSP^nl-BOP Bump on Pad CSP (Amkor)

[48]

Blank add chip CSP^nl-Bump on Repassivation / Redistribution (Amkor)

[49]

Blank add chip etCSP Extremely Thin CSP (Amkor) Same as XFBGA, WFBGA ?)

[50]

Blank add chip fcCSP, FCCSP Flip Chip CSP

[51]

Blank add chip FFCSP flexible carrier folded real CSP
Blank add chip M2CSP  ?
Blank add chip Memory CSP  ?
Blank add chip MCSP  ?
Blank add chip NCSP Near CSP
Blank add chip PBCSP Polymer Bumper CSP
Blank add chip WL-CSP, WLCSP, WCSP, Nanostar WLP Wafer level CSP
LAMINATED UCSP 20L UCSP LAMINATED U CSP [52]

[53]

Blank add chip TCSP LAMINATED T CSP

[54]

Blank add chip tsCSP Thin substrate CSP

JEDEC MO-247 [55]

Blank add chip LFCSP LeadFrame CSP (Analog Devices)
Blank add chip SuperFC Super flip chip (Amkor)

JEDEC MS-034 [56]

Blank add chip SCSP Stacked CSP

FC: Flip ChipEdit

Image Abbrv Full Name JEDEC/JEITA
Blank add chip FCiP FC in Package
Blank add chip FLMP FC in a Leaded Molded Package (Fairchild)
Blank add chip SuperFC Super FC (Amkor)

JEDEC MS-034 [57]

CGA: Column Grid ArrayEdit

Collumn grid array (CGA)


Image Abbrv Full Name JEDEC/JEITA
Blank add chip CCGA ceramic column grid array

[58]

Blank add chip CuCGA Copper Column Grid Array

[59]


OtherEdit

Image Abbrv Full Name JEDEC/JEITA
SHELLOP 36L SHELLOP  ?

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